BY-10 wafer cleaning agent

Overview

The agent is developed according to the actual production of the user, and is suitable for the surface cleaning treatment of the silicon wafer, and can effectively remove the residual pollutants after the surface of the solar wafer is cut, so that the surface of the silicon wafer is clean and uniform. The agent is alkaline, liquid, low foam, non-phosphorus, and is used in one component. The agent has strong adaptability and can be applied to manual and automatic ultrasonic cleaning production lines of various processes.

Typical process

1) Pre-cleaning of circulating deionized water (30-40 ° C, 4~10 minutes)

2) Pre-cleaning of circulating deionized water (30-40 ° C, 4~10 minutes)

3) BY-10 cleaning treatment (40~70°C, 4~10 minutes)

4) BY-10 cleaning treatment (40~70°C, 4~10 minutes)

5) Circulating deionized water rinse (50~60°C, 4~10 minutes)

6) Circulating deionized water rinse (50~60°C, 4~10 minutes)

7) Rinse deionized water rinse (60~70°C, 4~10 minutes)

8) Drying or tunnel drying or texturing

main feature

1) The surface of the silicon wafer is not easy to produce excessive corrosion, and there is no blackening or bluening.

2) Medium temperature use, low cost, fast speed and good effect.

3) The cleaning performance is good, and there is no residue on the surface of the cleaned silicon wafer. There is no whitening phenomenon, especially after the texturing process.

4) With ultrasonic, the cleaning effect is better.

5) After cleaning, it generally improves electrical performance and helps to increase conversion rate.

6) Generally, it can improve the minority carrier life and body life of the silicon wafer surface, and help to improve the conversion rate.

Process parameters

1) Distribution tank concentration: 2% (for line slicing plant), 0.5-1% (for battery sheet factory)

2) Bath temperature: 40~70°C (typically 45~65°C)

3) Processing time: 4~10 minutes

Alignment method

1) Line slicing factory: Add 80% deionized water to the cleaning tank, weigh the added BY-10 type silicon wafer cleaning agent, then add deionized water to the working liquid level, stir the cycle evenly, and warm to work. After the temperature, the ultrasonic waves are turned on for cleaning.

2) Battery factory: Add 80% deionized water to the cleaning tank, weigh 0.5~1% BY-10 type silicon wafer cleaning agent, then add deionized water to the working level, and stir evenly. After warming to the working temperature, the ultrasonic waves are turned on for cleaning.

Maintenance control

1) After using the working fluid for a period of time, the cleaning will decrease, and it should be added in time. It is generally recommended to add 1 liter of BY-10 type silicon wafer cleaning agent for every 4000 pieces of cleaning; the battery sheet factory usually purchases 6000 to 8000 pieces for cleaning. 1 liter BY-10 type silicon wafer cleaning agent; 1 liter BY-10 type silicon wafer cleaning agent is added every 20,000 pieces with automatic pre-cleaning process.

2) If the concentration of the cleaning agent is too high, the surface reaction speed will increase, and after working for a while, it will return to normal.

3) When there are too many impurities in the cleaning working fluid, the cleaning effect of the bath liquid and the efficiency of the ultrasonic wave will decrease. It is necessary to consider replacing the working fluid. Generally, the bath liquid is replaced once according to the production condition.

Precautions

1) The cleaned silicon wafer should be thoroughly rinsed, and the water wash should maintain a circulating overflow.

2) It should be monitored every 4 hours and added in time to ensure the cleaning effect.

3) Packed in 25kg or 2kg plastic drums and stored in the original packaging. This product is valid for one year.

4) Pay attention to the safety of operation, minimize the direct contact between skin, eyes and mouth and cleaning agent. If contact, rinse immediately with plenty of water.

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